CDF will conduct a follow-up status review of the Run II VME TDC sub-project. A review was conducted in Sept 2000 which focussed primarily on the manufacturing defect which resulted in broken vias on the boards. Following that review the committee recommended that CDF purchase new TDC boards to replace boards with bad vias. It also recommended that a task force be set up to address the technical problems with operation of the boards. Following the recommendations of that review, a TDC task force was formed in October. This group has been very effective in uncovering and fixing the know problems with the TDC's. We currently believe that nearly all these problems have been satisfactorily resolved. In addition, we have begun the process to purchase a total of 200 new TDC modules: 125 LVDS and 75 ECL. The purpose of the follow up review is to evaluate technical status of this system including our readiness to produce new boards and to provide advice and guidance to the CDF Upgrade Project and CDF Operations management on any remaining problems or concerns. The review will take place at Fermilab 1:30pm - 5:30pm on Wednesday January 24, 2001. The Review will be held in the XXXXYYYY. Following the review, the committee will be asked to prepare a short written document summarizing its findings and recommendations. Committee: Tony Liss Chairman Henry Frisch Bill Foster Michael Schmidt Aseet Mukherjee Rick Van Berg Harold Sanders Terri Shaw ================================================================== Charge to TDC Review Committee CDF employs a custom VME TDC to readout the Central Outer Tracker and Muon chambers for Run II. A total of 540 TDC's including spares are being built. (405 LVDS for COT, and 135 ECL input for Muon systems) These TDC's were designed by University of Michigan. The PC boards are manufactured and partially assembled in industry. The final assembly and testing is done at Michigan. Maintenance of the system is shared between FNAL (PREP) and Michigan. During installation and commissioning, several design problems were discovered that prevented the proper operation of TDC boards. Some of these problems, such as failing buffer chips, were described at the previous review. However, several readout problems were only uncovered when large numbers of boards were operated prior to and during the commissioning run. Most of these problems are now understood and hardware or firmware design changes have been made. These problems include: blown buffer chips, bunch counter errors, and data corruption in the so-called early done mode readout. At this time there is one remaining known design problem which results in the board hanging when high hit rates are present. It is expected that a solution to this problem will be found within a few days. The committee will be presented with the status of the work of the TDC Task Task force. This will include the effort to uncover design problems and implement solutions. They will also report on board performance including operational reliability and readout rate capabilities. The committee will be presented with a plan to implement the changes in the layout for the new boards and for production of those boards. Finally, the committee will be presented with a plan for operational support in B0, at PREP and at University of Michigan. The purpose of this review is to evaluate the current state of the TDC project from a technical standpoint. The committee should evaluate whether all the design problems have been addressed and complete tests of solutions have been carried out. The committee should recommend an overall course of action to the head of the CDF FE/Trig subsystem, the CDF upgrade project managers, and the CDF operations department heads that they believe will lead to a reliable TDC's operation at CDF for the duration of Run II.